Case study: semiconductor foundry operations

Follow wafer losses from lot to process.

Yield is one view of the result. Datansh connected where wafer quantities changed, which process readings were unusual and the related quality, supplier and claim information, so teams could prioritize investigation.

More context behind the yield figure

Wafer-lot history, step movements, process-control measurements, yield and related quality information are different views of one operating environment, not interchangeable measures of loss.

A useful review preserves the lot and process involved, the measurement and limit compared, and the scope of any financial claim.

What Datansh delivered

Wafer-lot and step tracking
Reporting followed wafer lots through manufacturing steps and production history to show where quantities changed.
Process-control investigation
Measurement views compared wafer-test results with specification limits and history to show readings that needed attention.
Quality and financial context
Yield, scrap, supplier-quality information and financial claims presented together, so teams could prioritize what to investigate.

Comparing measurements with limits or history is not, by itself, evidence of a deployed machine-learning model.

What the evidence supports

Connected reporting and analysis across wafer movement, process readings, quality and claims. No measured reduction in wafer scrap, before-and-after yield gain or recovered claim payments is claimed.

A separate historical reporting scope

The earlier website also reports a KPI-monitoring scope connecting SAP, SharePoint and on-premise databases. These figures relate to that scope, not to the wafer-quality views above.

3Source systems unified for the historical KPI-reporting scopeReported, as published in Datansh case studies
100%Of the targeted KPI monitoring digitized in that scopeReported, as published in Datansh case studies
~ 30%Faster issue identification reported for that scopeReported, as published in Datansh case studies

These figures do not establish equivalent reductions in scrap, defects or investigation time in the wafer-quality scope. The export does not include the measurement method for the issue-identification figure.

More manufacturing work

Production and quality, visible on the plant floor
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Consistent reporting across a distributed manufacturer
Shared models, monitoring and controlled reporting releases.
Read the reporting-governance case